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 AP9435GH/J
RoHS-compliant Product
Advanced Power Electronics Corp.
Low Gate Charge Simple Drive Requirement Fast Switching G S D
P-CHANNEL ENHANCEMENT MODE POWER MOSFET
BVDSS RDS(ON) ID
-30V 50m - 20A
Description
G
Advanced Power MOSFETs utilized advanced processing techniques to achieve the lowest possible on-resistance, extremely efficient and costeffectiveness device. The TO-252/TO-251 package is widely used for commercial-industrial application.
G D
D
S
TO-252(H)
S
TO-251(J)
Absolute Maximum Ratings
Symbol VDS VGS ID@TC=25 ID@TC=100 IDM PD@TC=25 TSTG TJ Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Continuous Drain Current Pulsed Drain Current
1
Rating - 30 20 - 20 -13 -60 12.5 0.1 -55 to 150 -55 to 150
Units V V A A A W W/
Total Power Dissipation Linear Derating Factor Storage Temperature Range Operating Junction Temperature Range
Thermal Data
Symbol Rthj-c Rthj-a Parameter Maximum Thermal Resistance, Junction-case Maximum Thermal Resistance, Junction-ambient Value 10 110 Units /W /W
Data and specifications subject to change without notice
201017075-1/4
AP9435GH/J
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol BVDSS RDS(ON) Parameter Drain-Source Breakdown Voltage Static Drain-Source On-Resistance2 Test Conditions VGS=0V, ID=-250uA VGS=-10V, ID=-10A VGS=-4.5V, ID=-5A VGS(th) gfs IDSS IGSS Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss Gate Threshold Voltage Forward Transconductance
Drain-Source Leakage Current (Tj=25oC) Drain-Source Leakage Current (Tj=150oC)
Min. -30 -1 -
Typ. 10 8 1.6 4.3 6.3 46 20 7.4 570 80 75
Max. Units 50 90 -3 -1 -25 100 16 740 V m m V S uA uA nA nC nC nC ns ns ns ns pF pF pF
VDS=VGS, ID=-250uA VDS=-10V, ID=-10A VDS=-30V, VGS=0V VDS=-24V, VGS=0V VGS= 20V ID=-10A VDS=-24V VGS=-4.5V VDS=-15V ID=-10A RG=3.3,VGS=-10V RD=1.5 VGS=0V VDS=-25V f=1.0MHz
Gate-Source Leakage Total Gate Charge
2
Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
2
Source-Drain Diode
Symbol VSD trr Qrr Parameter Forward On Voltage
2 2
Test Conditions IS=-10A, VGS=0V IS=-10A, VGS=0V, dI/dt=-100A/s
Min. -
Typ. 18 10
Max. Units -1.3 V ns nC
Reverse Recovery Time
Reverse Recovery Charge
Notes:
1.Pulse width limited by Max. junction temperature. 2.Pulse test
THIS PRODUCT IS AN ELECTROSTATIC SENSITIVE, PLEASE HANDLE WITH CAUTION.
THIS PRODUCT HAS BEEN QUALIFIED FOR CONSUMER MARKET. APPLICATIONS OR USES AS CRITERIAL COMPONENT IN LIFE SUPPORT
DEVICE OR SYSTEM ARE NOT AUTHORIZED. 2/4
AP9435GH/J
80 70
T C =25 C
60
o
-10V
60
T C =150 C
o
-10V -8.0V
-8.0V -ID , Drain Current (A)
50
-ID , Drain Current (A)
-6.0V
40
40
-6.0V
30
-4.5V
20
-4.5V
20
V G =-4.0V
V G =-4.0V
10
0 0 2 4 6 8 10
0 0 2 4 6 8
-V DS , Drain-to-Source Voltage (V)
-V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
90
1.8
I D =-10A T C =25
80 1.6
I D =-10A V G =-10V
Normalized RDS(ON)
RDS(ON) (m)
70
1.4
60
1.2
50
1.0
40
0.8
30 2 4 6 8 10
0.6 -50 0 50 100 150
-V GS , Gate-to-Source Voltage (V)
T j , Junction Temperature ( C)
o
Fig 3. On-Resistance v.s. Gate Voltage
Fig 4. Normalized On-Resistance v.s. Junction Temperature
2
10
8
1.8
-VGS(th) (V)
6
1.6
-IS(A)
T j =150 o C
4
T j =25 o C
1.4
2
1.2
0 0 0.2 0.4 0.6 0.8 1 1.2 1.4
1 -50 0 50 100 150
-V SD , Source-to-Drain Voltage (V)
T j , Junction Temperature ( o C)
Fig5. Forward Characteristic of
Reverse Diode
Fig 6. Gate Threshold Voltage v.s. Junction Temperature
3/4
AP9435GH/J
f=1.0MHz
12 1000
-VGS , Gate to Source Voltage (V)
10
I D =-10A V DS =-24V
Ciss
8
6
C (pF)
100
Coss Crss
4
2
0 0 4 8 12 16 20
10
1 5 9 13 17 21 25 29
Q G , Total Gate Charge (nC)
-V DS , Drain-to-Source Voltage (V)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (Rthjc)
Duty factor=0.5
10
0.2
-ID(A)
100us
0.1
0.1
0.05
PDM
0.02
1
o T C =25 C Single Pulse
1ms 10ms 100ms DC
t T
0.01
Single Pulse
Duty factor = t/T Peak Tj = PDM x Rthjc + TC
0.1 0.1 1 10 100
0.01 0.00001 0.0001 0.001 0.01 0.1 1
-V DS , Drain-to-Source Voltage (V)
t , Pulse Width (s)
Fig 9. Maximum Safe Operating Area
Fig 10. Effective Transient Thermal Impedance
VDS 90%
VG QG -4.5V QGS QGD
10% VGS td(on) tr td(off) tf Charge Q
Fig 11. Switching Time Waveform
Fig 12. Gate Charge Waveform
4/4
ADVANCED POWER ELECTRONICS CORP.
Package Outline : TO-252
D D1
SYMBOLS
Millimeters
MIN NOM MAX
A2 A3 B1 D D1 E3
1.80 0.40 0.40 6.00 4.80 3.50 2.20 0.5 5.10 0.50 -0.35
2.30 0.50 0.70 6.50 5.35 4.00 2.63 0.85 5.70 1.10 2.30 0.50
2.80 0.60 1.00 7.00 5.90 4.50 3.05 1.20 6.30 1.80 -0.65
E2
E3 E1
F F1 E1 E2 e C
B1
F1
F
1.All Dimensions Are in Millimeters. 2.Dimension Does Not Include Mold Protrusions.
e
e
A2
R : 0.127~0.381
A3
(0.1mm
C
Part Marking Information & Packing : TO-252
Part Number
meet Rohs requirement 9435GH
Package Code
LOGO
YWWSSS
Date Code (YWWSSS) YLast Digit Of The Year WWWeek SSSSequence
ADVANCED POWER ELECTRONICS CORP.
D
A
Millimeters c1
SYMBOLS MIN NOM MAX Original
D1 A E2 A1 B1 E1 E B2
Original Original
2.10 0.60 0.40 0.60 0.40 0.40 6.00 4.80 5.00 1.20 ---7.00
2.30 1.20 0.60 0.95 0.50 0.55 6.50 5.40 5.50 1.70 2.30 ---
2.50 1.80 0.80 1.25 0.65 0.70 7.00 5.90 6.00 2.20 ---16.70
c c1
D
A1
B2 B1 F
D1 E1 E2
e
F
1.All Dimensions Are in Millimeters.
c
2.Dimension Does Not Include Mold Protrusions.
e
e
Part Marking Information & Packing : TO-251
Part Number
9435GJ
meet Rohs requirement
Package Code LOGO Date Code (YWWSSS) Y Last Digit Of The Year WW Week SSS Sequence
YWWSSS


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